Semiconductor devices with extended active regions

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

Reexamination Certificate

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C257SE21560, C438S296000, C438S430000

Reexamination Certificate

active

08062953

ABSTRACT:
A method of making a semiconductor device is achieved in and over a semiconductor layer. A trench is formed adjacent to a first active area. The trench is filled with insulating material. A masking feature is formed over a center portion of the trench to expose a first side of the trench between a first side of the masking feature and the first active area. A step of etching into the first side of the trench leaves a first recess in the trench. A first epitaxial region is grown in the first recess to extend the first active area to include the first recess and thereby form an extended first active region.

REFERENCES:
patent: 6483156 (2002-11-01), Adkisson et al.
patent: 6503799 (2003-01-01), Horita et al.
patent: 6660596 (2003-12-01), Adkisson et al.
patent: 6716571 (2004-04-01), Gabriel et al.
patent: 2002/0160320 (2002-10-01), Shields et al.
patent: 2008/0079076 (2008-04-01), Sheen et al.
patent: 10-2005-0045599 (2005-05-01), None
International Application No. PCT/US2009/043457, International Search Report and Written Opinion dated Dec. 29, 2009.

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