Semiconductor devices having superconducting interconnects

Details Semiconductor devices having superconducting interconnects Semiconductor devices having superconducting interconnects

1987-09-09

1989-06-06

Edlow, Martin H.

Superconductor technology: apparatus, material, process

High temperature , per se

Having tc greater than or equal to 150 k

505923, 505922, 505919, 357 67, 357 5, H01L 2948

Patent

active

048376094

ABSTRACT:
A semiconductor device which includes either a single semiconductor chip bearing an integrated circuit (IC) or two or more electrically interconnected semiconductor chips, is disclosed. This device includes interconnects between device components (on the same chip and/or on different chips), at least one of which includes a region of superconducting material, e.g., a region of copper oxide superconductor having a T.sub.c greater than about 77K. Significantly, to avoid undesirable interactions, at high processing temperatures, between the superconducting material and underlying, silicon-containing material (which, among other things, results in the superconducting material reverting to its non-superconducting state), the interconnect also includes a combination of material regions which prevents such interactions.

REFERENCES:
patent: 4141022 (1979-02-01), Sigg
patent: 4507851 (1985-04-01), Joyner
patent: 4660061 (1987-04-01), Sweeny
patent: 4724475 (1988-02-01), Matsuda

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