Semiconductor devices having different package sizes made by...

Details Semiconductor devices having different package sizes made by... Semiconductor devices having different package sizes made by...

2005-02-15

2005-02-15

Clark, S. V. (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S121000

Reexamination Certificate

active

06855577

ABSTRACT:
A semiconductor device having a semiconductor element and a plurality of segments formed by dividing a conductive plate. Some of the segments are electrically coupled with electrodes of said semiconductor element and constitute lead pad portions as mounting electrodes of the semiconductor device. Other segments among the plurality of divided segments constitute die pad portions on which the semiconductor element is mounted. The plurality of divided segments and the semiconductor element are sealed and supported together by a resin material portion. The resin material portion fills the space between the divided segments as the lead pad portions. Semiconductor devices having various package sizes can be fabricated by using standardized common parts.

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