Semiconductor devices having copper terminal leads

Details Semiconductor devices having copper terminal leads Semiconductor devices having copper terminal leads

1992-03-24

1994-04-19

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

257694, 257784, H01L 2328, H01L 2349

Patent

active

053044290

ABSTRACT:
In a semiconductor device comprising a copper lead brazed to a metal member of the device in a thermal process causing annealing and undesirable softening of the lead, the lead is stiffened in a process comprising applying a tensile force along the length of the lead and between it and the member to which it is brazed for stretching the lead beyond its elastic limit. The stretching process causes sitffening of the lead, removes bends in the lead, if present, and serves as a test for defective brazed joints.

REFERENCES:
patent: 3050666 (1962-08-01), Stump
patent: 3197843 (1965-08-01), Nippert
patent: 3282748 (1966-11-01), Martens
patent: 3787966 (1974-01-01), Klossika
patent: 3996602 (1976-12-01), Goldberg et al.
patent: 4149310 (1979-04-01), Nippert
patent: 4423618 (1984-01-01), Clarke
patent: 5101263 (1992-03-01), Kitano et al.
Metal Handbook, 9th Ed., vol. 2, "Properties and Selection: Nonferrous Alloys and Pure Metals", American Society for Metals, 1974, pp. 239-241.

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