Patent
1974-02-26
1976-02-03
Miller, Jr., Stanley D.
357 53, 357 71, H01L 2940, H01L 2348, H01L 2946
Patent
active
039368653
ABSTRACT:
A semiconductor device comprising a semiconductor body comprising a first surface, a first insulating layer on said first surface of the semiconductor body, a first conductive connection layer comprising a strip portion and disposed on said first insulating layer, a second insulating layer overlying said first insulating layer and first conductive connection layer, and a second conductive connection layer situated on said second insulating layer, said second insulating layer comprising an aperture that at least partly overlies said strip portion of said first conductive connection layer and has a cross-dimension d in a direction substantially at right angles to the longitudinal direction of said strip portion, a contact portion of said second conductive connection layer completely covering said aperture and contacting said strip portion of said first conductive connection layer via said aperture, wherein x < d + 2t and x represents the width of said strip portion and t the alignment tolerance associated with the definition of said aperture with respect to said strip portion.
REFERENCES:
patent: 3576668 (1971-04-01), Fenster et al.
Miller, Jr. Stanley D.
Nigohosian Leon
Trifari Frank R.
U.S. Philips Corporation
Wojciechowicz E.
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