Semiconductor devices having backside probing capability

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257 48, 438 18, H01L 2348, H01L 2352, H01L 2940, H01L 2358

Patent

active

059905620

ABSTRACT:
Integrated circuits are provided which permit backside probing while being operated. Conductive trenches are fabricated into the surface of semiconductor chip at preselected locations. Access to specific electrically connected nodes of the integrated circuit can be effected through the conductive trenches by backside thinning and milling of the semiconductor chip followed by e-beam probe or mechanical probe usage.

REFERENCES:
patent: 4573008 (1986-02-01), Lischke
patent: 4688063 (1987-08-01), Lu et al.
patent: 4751458 (1988-06-01), Elward, Jr.
patent: 4873205 (1989-10-01), Critchlow et al.
patent: 4888087 (1989-12-01), Moslehi et al.
patent: 4924589 (1990-05-01), Leedy
patent: 4983544 (1991-01-01), Lu et al.
patent: 4983908 (1991-01-01), Tada et al.
patent: 5210599 (1993-05-01), Kawai
patent: 5270261 (1993-12-01), Bertin et al.
patent: 5321304 (1994-06-01), Rostoker
patent: 5424245 (1995-06-01), Gurtler et al.
patent: 5444021 (1995-08-01), Chung et al.
patent: 5481205 (1996-01-01), Frye et al.
patent: 5814889 (1998-09-01), Gaul

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor devices having backside probing capability does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor devices having backside probing capability, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor devices having backside probing capability will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1224957

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.