Semiconductor devices by laser enhanced diffusion

Coating processes – Electrical product produced – Welding electrode

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219121LE, 219121LF, 427 85, B05D 306

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043438326

ABSTRACT:
A process is described for the doping of semiconductors utilizing laser beam melting of the semiconductor surface in the presence of a dopant source. By selecting the laser wavelength to satisfy one of several criteria relating the semiconductor absorption coefficient and wafer thickness, or the dopant thickness and doping depth, the heating and melting are constrained to occur in a small local region near the surface where the laser beam impinges. Use of this invention to produce Zener diodes having abrupt doping profiles, as well as other device structures, is also discussed.

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Kaplan et al., "Journ. Electro Chem. Soc.", V126, No. 8, Aug. 1979, Abst. No. 503, p. 3616.

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