Semiconductor devices and methods of making the devices

Details Semiconductor devices and methods of making the devices Semiconductor devices and methods of making the devices

2005-03-01

2005-03-01

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C438S124000, C438S125000

Reexamination Certificate

active

06861294

ABSTRACT:
A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

REFERENCES:
patent: 4099200 (1978-07-01), Koutalides
patent: 4864383 (1989-09-01), Gloton et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4899207 (1990-02-01), Hallowell et al.
patent: 5053855 (1991-10-01), Michii et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5157475 (1992-10-01), Yamaguchi
patent: 5200362 (1993-04-01), Lin
patent: 5216278 (1993-06-01), Lin et al.
patent: 5218759 (1993-06-01), Juskey
patent: 5239198 (1993-08-01), Lin
patent: 5241133 (1993-08-01), Mullen
patent: 5256903 (1993-10-01), Obata
patent: 5293072 (1994-03-01), Tsuji et al.
patent: 5294827 (1994-03-01), McShane
patent: 5304843 (1994-04-01), Takubo
patent: 5332864 (1994-07-01), Liang et al.
patent: 5358904 (1994-10-01), Murakami et al.
patent: 5365106 (1994-11-01), Watanabe
patent: 5378924 (1995-01-01), Liang
patent: 5391916 (1995-02-01), Kohno et al.
patent: 5490324 (1996-02-01), Newman
patent: 5639695 (1997-06-01), Jones et al.
patent: 5650593 (1997-07-01), McMillan
patent: 5693572 (1997-12-01), Bond et al.
patent: 5827999 (1998-10-01), McMillan et al.
patent: 5914531 (1999-06-01), Tsunoda et al.
patent: 0 595 300 (1994-05-01), None
patent: 61-46049 (1986-10-01), None
patent: 61-222151 (1986-10-01), None
patent: 62-277753 (1987-02-01), None
patent: 2-309660 (1990-12-01), None
patent: 04-184944 (1992-07-01), None
patent: 05-129391 (1993-05-01), None
patent: 230273 (1994-09-01), None
patent: 230274 (1994-09-01), None
Jim Sloan, The First VLSI Packaging Workshop of Japan, Nov. 30, 1992. pp. 17-27.

Affiliated with

Also associated with

Rating

Semiconductor devices and methods of making the devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor devices and methods of making the devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor devices and methods of making the devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3400387