Semiconductor devices and method of manufacturing the same

Metal working – Method of mechanical manufacture – Assembling or joining

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29578, 29579, 29591, 357 59, B01J 1700

Patent

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041887077

ABSTRACT:
The semiconductor device comprises a semiconductor substrate, a polycrystalline silicon semiconductor body extending upwardly from a portion of the surface of the semiconductor substrate and containing an impurity at a substantially uniform concentration, and a metal electrode disposed on the top surface of the polycrystalline silicon semiconductor body. The metal electrode extends in the lateral direction beyond the periphery of the top surface of the polycrystalline silicon semiconductor body.

REFERENCES:
patent: 3481030 (1969-12-01), Te Velde
patent: 4016587 (1977-04-01), De La Moneda
patent: 4057820 (1977-11-01), Gallagher

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