Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1977-07-11
1980-02-19
Tupman, W. C.
Metal working
Method of mechanical manufacture
Assembling or joining
29578, 29579, 29591, 357 59, B01J 1700
Patent
active
041887077
ABSTRACT:
The semiconductor device comprises a semiconductor substrate, a polycrystalline silicon semiconductor body extending upwardly from a portion of the surface of the semiconductor substrate and containing an impurity at a substantially uniform concentration, and a metal electrode disposed on the top surface of the polycrystalline silicon semiconductor body. The metal electrode extends in the lateral direction beyond the periphery of the top surface of the polycrystalline silicon semiconductor body.
REFERENCES:
patent: 3481030 (1969-12-01), Te Velde
patent: 4016587 (1977-04-01), De La Moneda
patent: 4057820 (1977-11-01), Gallagher
Asano Masaru
Sakai Tetsushi
Sunohara Yoshio
Nippon Telegraph and Telephone Public Corporation
Pfund Charles E.
Tupman W. C.
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