Semiconductor devices and manufacturing method therefor and...

Registers – Records – Conductive

Reexamination Certificate

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C340S572700, C343S7000MS

Reexamination Certificate

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11370902

ABSTRACT:
A wireless IC tag is provided which includes a plate-shaped first conductor, a plate-shaped second conductor, and an IC chip which is sandwiched between the first conductor and the second conductor via a front surface and a rear surface of the IC chip. The IC chip includes a double voltage rectifier circuit to rectify an alternating voltage induced between the front surface and the rear surface of the IC chip. The second conductor functions as an antenna and also includes a slit extending from a center portion thereof in a longitudinal direction. The first conductor electrically connects both sides of the slit via the front surface and the rear surface of the IC chip.

REFERENCES:
patent: 4691304 (1987-09-01), Hori et al.
patent: 4816839 (1989-03-01), Landt
patent: 5027107 (1991-06-01), Matsuno et al.
patent: 5781159 (1998-07-01), Desargant
patent: 5786626 (1998-07-01), Brady et al.
patent: 6011488 (2000-01-01), Busser
patent: 6504507 (2003-01-01), Geeraert
patent: 6525410 (2003-02-01), Gelsomini et al.
patent: 6563463 (2003-05-01), Saito
patent: 6657432 (2003-12-01), Morrone
patent: 6657542 (2003-12-01), Usami
patent: 6762682 (2004-07-01), Okamoto et al.
patent: 6795025 (2004-09-01), Saito
patent: 6836248 (2004-12-01), Fukushima et al.
patent: 6900536 (2005-05-01), Derbenwick et al.
patent: 6930401 (2005-08-01), Usami
patent: 6985119 (2006-01-01), Forster et al.
patent: 7036741 (2006-05-01), Usami et al.
patent: 2005/0093677 (2005-05-01), Forster et al.
patent: 2005/0134460 (2005-06-01), Usami
patent: 2005/0275591 (2005-12-01), King et al.
patent: 4-119645 (1992-04-01), None
patent: 10-13296 (1998-01-01), None
patent: 2000-76406 (2000-03-01), None
patent: 2000-132653 (2000-05-01), None
patent: 2001-94031 (2001-04-01), None
patent: 2002-366917 (2002-12-01), None

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