Semiconductor devices and manufacturing method therefor

Details Semiconductor devices and manufacturing method therefor Semiconductor devices and manufacturing method therefor

2007-11-20

2007-11-20

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257S777000, C257S778000, C257S773000, C257S763000, C257S723000, C257S724000

Reexamination Certificate

active

11101577

ABSTRACT:
A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.

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Japanese Office Action Jun. 20, 2006.

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