Semiconductor devices and electrical parts manufacturing...

Details Semiconductor devices and electrical parts manufacturing... Semiconductor devices and electrical parts manufacturing...

2007-03-26

2011-12-27

Pizarro, Marcos D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S684000, C257SE23025

Reexamination Certificate

active

08084870

ABSTRACT:
The device of this invention includes a semiconductor die attached to a bare copper lead frame and electrically coupled to a lead by a metal wire coated with a metallic material. The device would function similarly to devices where the lead frames were coated with other metallic materials, but at lower costs because instead of plating the lead frame the wire is plated. The wire can be either gold or aluminum. When the wire is gold, the coating may be silver or other suitable metallic materials. When the wire is aluminum, the coating may be nickel, palladium, or other suitable metals.

REFERENCES:
patent: 5608260 (1997-03-01), Carper et al.
patent: 5772451 (1998-06-01), Dozier et al.
patent: 2001/0020545 (2001-09-01), Eldridge et al.
patent: 2002/0117330 (2002-08-01), Eldridge et al.
patent: 2004/0032015 (2004-02-01), Sekiguchi et al.
patent: 2004/0245320 (2004-12-01), Fukagaya et al.
Michael Quirk, Semiconductor Manufacturing Technology, Prentice Hall 2001.

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