Semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

Reexamination Certificate

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C257S529000, C257S530000

Reexamination Certificate

active

06876015

ABSTRACT:
A semiconductor device may include a fuse section110in which a plurality of fuses20to be fused by irradiation of a laser beam are formed. The fuses20are arranged at a pitch X, and an insulation layer36having a specified film thickness covers upper portions of the fuses20. The fuses20may have a width W and a film thickness T that have a relation indicated by the following equation: T≧0.4/W. Furthermore, the width W of the fuse20may be 3 μm or less, and may be less than ½ of the pitch X of the fuses20. Also, the film thickness of the fuse20may be 0.7 μm or less.

REFERENCES:
patent: 6320243 (2001-11-01), Jeong et al.
patent: 6366503 (2002-04-01), Sonoda
patent: 6413848 (2002-07-01), Giust et al.
patent: 6433406 (2002-08-01), Kagiwata
patent: 6509624 (2003-01-01), Radens et al.
patent: 20020125576 (2002-09-01), Koyama et al.
patent: 20030038339 (2003-02-01), Mori
patent: 20030052385 (2003-03-01), Mori
patent: 09-172087 (1997-06-01), None
patent: 11-087521 (1999-03-01), None
patent: 11-260922 (1999-09-01), None
patent: 2000-243845 (2000-09-01), None
patent: 2000-268699 (2000-09-01), None
Notice of Reasons of Rejection for Japanese Patent Application No. 2001-224690 (from which priority was claimed for 10/202,063) dated Jun. 10, 2003 (which lists 11-260922 and 2000-243845 cited above).
Notice of Reasons of Rejection for Japanese Patent Application No. 2001-224689 (from which priority was claimed for 10/202,044) dated Jun. 10, 2003 (which lists 09-172087 cited above).
Notice of Reasons of Rejection for Japanese Patent Application No. 2001-224688 (from which priority was claimed for 10/202,028) dated Jun. 10, 2003 (which lists 2000-268699 and 11-087521 cited above).

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