Semiconductor device with wiring layer

Details Semiconductor device with wiring layer Semiconductor device with wiring layer

1994-06-15

1996-03-26

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257764, 257767, 257769, 257775, H01L 23532, H01L 2943

Patent

active

055023355

ABSTRACT:
The present invention relates to a semiconductor device which has a wiring system including a wiring formed by completely surrounding a periphery of isolation films with a metal conductor as a main wiring material as viewed in a cross sectional profile and a contact opening and a through hole opening where the main wiring material is buried and a manufacturing method thereof.

REFERENCES:
patent: 4800176 (1989-01-01), Kakumu et al.
patent: 4833519 (1989-05-01), Kawano et al.
patent: 4935804 (1990-06-01), Ito et al.
patent: 5254872 (1993-10-01), Yoda et al.

Affiliated with

Also associated with

Rating

Semiconductor device with wiring layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device with wiring layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with wiring layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-918040