Semiconductor device with thermally compensating SiO.sub.2 -sili

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357 16, 357 49, 357 52, 357 60, 357 71, H01L 2934

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042246369

ABSTRACT:
A semiconductor device comprising a semiconductor substrate and protective films formed thereon. The protective films comprise at least one silicon carbide film which may be pure or may contain particular impurities.

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