Semiconductor device manufacturing: process – Making point contact device – Direct application of electrical current
Reexamination Certificate
2007-01-23
2007-01-23
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
Making point contact device
Direct application of electrical current
C438S017000, C438S106000, C438S113000
Reexamination Certificate
active
10336801
ABSTRACT:
A plurality of semiconductor chips is mounted on a surface of a substrate to be used for manufacturing semiconductor devices. The semiconductor chips are collectively sealed with resin, thereby forming resin-sealed sections. A plurality of solder balls are formed on the back surface of the substrate such that an interval A between the closest solder balls of adjacent semiconductor chips becomes “n” times (“n” is an integer greater than 1) an interval B between the solder balls on the semiconductor chip. After the semiconductor chips have been subjected to an electrical test, the resin-sealed sections and the substrate are sliced, thus breaking the semiconductor chips into pieces.
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Michii Kazunari
Semba Shinji
Shinonaga Naoyuki
Booth Richard A.
Renesas Technology Corp.
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