Semiconductor device with tape automated bonding element

Details Semiconductor device with tape automated bonding element Semiconductor device with tape automated bonding element

1996-07-30

1998-03-24

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257737, 257778, H01L 2314

Patent

active

057316317

ABSTRACT:
A semiconductor device having improved heat dissipation property and electrical characteristics and applicable to an integrated circuit having a multiplicity of electrodes, and a method of fabricating the semiconductor device are disclosed. A surface of a semiconductor chip (1) on which a bump (2) is formed is in face to face relation to a surface of a circuit substrate (3) on which a land (5) is formed. A polyimide tape (6) and a TAB lead (7) constitute a TAB tape. The bump (2) and the land (5) are electrically connected to each other through the flat TAB tape. The land (5) is electrically connected to an external connection electrode (4) through an interconnecting line within the circuit substrate (3). The TAB lead (7) extending from the bump (2) to the land (5) is reduced in length, and the signal through the TAB lead (7) accordingly has improved electrical characteristics. The use of the TAB tape permits the semiconductor device to be applied to the semiconductor chip (1) having the multiplicity of bumps (2).

REFERENCES:
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5350947 (1994-09-01), Takekawa et al.
patent: 5608262 (1997-03-01), Degani et al.

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