Semiconductor device with stress relief coating at the periphery

Details Semiconductor device with stress relief coating at the periphery Semiconductor device with stress relief coating at the periphery

1990-07-17

1991-08-27

Jackson, Jr., Jerome

357 74, H01L 2330, H01L 2308

Patent

active

050437933

ABSTRACT:
A semiconductor device comprising a semiconductor element (1), a carrier member (2) for the semiconductor element, electrical connection conductors (3) and wire connections (4) between connection areas (7) on the semiconductor element and the electrical connection conductors is provided with a coating (6, 9) on the surface of the semiconductor element remote from the carrier member, where the active circuit is situated, and is enveloped with a synthetic material. The coating (6, 9) is electrically insulating and has an elasticity for absorbing shear stresses which occur between the active surface (5) of the semiconductor element and the envelope. To prevent pattern shift as well as wire fracture or tearing off of the wire, the coating (9) is present only at the outer edge of the active surface of the semiconductor element (1), leaving the central portion of this surface exposed with the coating (9) extending beyond or around the connection areas (7) for the wire connections.

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