Semiconductor device with stacked semiconductor elements

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

C257S686000, C257S777000

Reexamination Certificate

active

06858920

ABSTRACT:
In a semiconductor device1, a substrate3carries the first semiconductor element2aand the second semiconductor element2b. The first semiconductor element2ahas a plurality of first pads4aand a plurality of second pads4barrayed along two facing sides of a major surface. The second semiconductor element2bhas a plurality of third pads4calong sides where the first pads4aand the second pads4bare arrayed, and a plurality of fourth pads4dalong sides where the first pads4aand the second pads4bare not arrayed. First wirings8electrically connect the plurality of third pads4cto the plurality of fourth pads4don the major surface. A plurality of electrodes5is arrayed along all the circumferential sides of the major surface of the substrate3. Second wirings6aelectrically connect the plurality of first pads4aand the plurality of fourth pads4drespectively to the plurality of electrodes5. Third wirings6belectrically connect the plurality of second pads4bto the plurality of third pads4c.

REFERENCES:
patent: 6159765 (2000-12-01), Drehobl et al.
patent: 09-232500 (1997-09-01), None
patent: 11-220091 (1999-08-01), None

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