Semiconductor device with stacked-semiconductor chips and...

Details Semiconductor device with stacked-semiconductor chips and... Semiconductor device with stacked-semiconductor chips and...

2005-03-01

2005-03-01

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S780000, C257S673000

Reexamination Certificate

active

06861760

ABSTRACT:
A semiconductor device comprises a plurality of semiconductor chips stacked in the direction of thickness. Each of the semiconductor chips includes an upper surface formed with electrodes. The semiconductor device further comprises a plurality of terminal portions disposed beside these semiconductor chips, and a plural pieces of wire for electrical connection from the electrodes to respective terminal portions. Each of the terminal portions is at an elevation lower than the highest electrodes, and higher than the lowest electrodes.

REFERENCES:
patent: 4541003 (1985-09-01), Otsuka et al.
patent: 5192371 (1993-03-01), Shuto et al.
patent: 5296737 (1994-03-01), Nishimura et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5331235 (1994-07-01), Chun
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5614766 (1997-03-01), Takasu et al.
patent: 5640044 (1997-06-01), Takehashi et al.
patent: 5770480 (1998-06-01), Ma et al.
patent: 5801432 (1998-09-01), Rostoker et al.
patent: 5814881 (1998-09-01), Alagaratnam et al.
patent: 5831441 (1998-11-01), Motooka et al.
patent: 5877478 (1999-03-01), Ando
patent: 5898220 (1999-04-01), Ball
patent: 5953589 (1999-09-01), Shim et al.
patent: 6005292 (1999-12-01), Roldan et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: RE36613 (2000-03-01), Ball
patent: 6069025 (2000-05-01), Kim
patent: 6072243 (2000-06-01), Nakanishi
patent: 6077724 (2000-06-01), Chen
patent: 6166443 (2000-12-01), Inaba et al.
patent: 6184574 (2001-02-01), Bissey
patent: 6441495 (2002-08-01), Oka et al.
patent: 6639315 (2003-10-01), Miura et al.
patent: 0005270441 (1993-02-01), None
patent: 404368167 (1992-12-01), None
patent: 408316300 (1996-11-01), None

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