Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2007-07-24
2007-07-24
Doan, Theresa (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S787000
Reexamination Certificate
active
11025065
ABSTRACT:
A method of manufacturing a semiconductor device which can solve a problem in which a wafer is warped by the influence of thermal contraction of a sealing resin due to a difference in thermal contraction between the wafer and the sealing resin. A second wafer on which electrodes are formed is stacked on a first wafer such that the electrodes of the second wafer are electrically connected to the electrodes formed on the first wafer, a portion between the first wafer and the second wafer is sealed with a resin, the second wafer and the sealing resin are half cut to expose the conductive posts from the sealing resin, conductive bumps for performing electric connection to an external circuit are formed on the exposed conductive posts, and the wafer is diced into independent semiconductor devices. In the resin sealing step, since both the first and second semiconductor elements are stacked in wafer states, a problem in which the wafers are warped by the influence of thermal contraction of the sealing resin due to a difference in thermal contraction between the wafers and the sealing resin can be solved.
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U.S. Appl. No. 09/797,907, “Semiconductor Device and the Method for Manufacturing the Same”.
Doan Theresa
Oki Electric Industry Co. Ltd.
Rabin & Berdo PC
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