Semiconductor device with stacked alternate-facing chips

Details Semiconductor device with stacked alternate-facing chips Semiconductor device with stacked alternate-facing chips

1995-11-09

1997-03-25

Meier, Stephen

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257723, 257786, 257783, H01L 2348, H01L 2352, H01L 2940

Patent

active

056147660

ABSTRACT:
The present invention relates to a structure of semiconductor chip joint for mounting a plurality of semiconductor chips onto a single package. The joint comprises two or more semiconductor chips, the chips each having an element formation surface and a rear surface and being piled up with their element formation surfaces directed either in a first direction or in a second direction by turns so that their element formation surfaces are opposed to each other while their rear surfaces are opposed to each other, a bonding pad provided on the element formation surface of the chip directed in the first direction, connecting pad provided on the element formation surface of the chip directed both in the first direction and in the second direction;

REFERENCES:
patent: 3256465 (1966-06-01), Weissenstern et al.
patent: 3577037 (1971-05-01), De Pietro et al.
patent: 4763188 (1988-08-01), Johnson
patent: 5422435 (1995-06-01), Takiar et al.

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