Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2008-08-06
2009-10-06
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S710000
Reexamination Certificate
active
07598611
ABSTRACT:
Side terminals3at respective corners of a package are higher than side terminals4on each side of the package. Thus, even if the side terminals4on each side are lower than those according to the conventional art owing to miniaturization or the like, when a device is mounted on a mounting substrate by soldering, a solder fillet11of a sufficient size can be formed between each of the corner side terminals3, which significantly affect reliability, and a corresponding terminal on the mounting substrate. Thus, the device can be more reliably mounted on the mounting substrate by soldering.
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Clark S. V
Panasonic Corporation
Steptoe & Johnson LLP
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