Semiconductor device with semiconductor chip mounted in package

Details Semiconductor device with semiconductor chip mounted in package Semiconductor device with semiconductor chip mounted in package

2006-04-11

2009-06-30

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

C257S676000

Reexamination Certificate

active

07554210

ABSTRACT:
A semiconductor device including a semiconductor chip having first and second principal surfaces is disclosed. The semiconductor chip includes a first electrode formed on the first principal surface and a second electrode formed on the second principal surface. A first lead frame includes a first connecting portion connected to the first electrode and a first terminal portion. A second lead frame includes a second connecting portion connected to the second electrode and a second terminal portion. The semiconductor chip is sealed by a housing. The housing is formed so as not to cover part of surfaces of the first and second connecting portions.

REFERENCES:
patent: 5434449 (1995-07-01), Himeno et al.
patent: 5521429 (1996-05-01), Aono et al.
patent: 6040626 (2000-03-01), Cheah et al.
patent: 6249041 (2001-06-01), Kasem et al.
patent: 6396127 (2002-05-01), Munoz et al.
patent: 6469398 (2002-10-01), Hori
patent: 6566164 (2003-05-01), Glenn et al.
patent: 11354702 (1999-12-01), None
patent: 2001-358259 (2001-12-01), None
patent: 2002-314018 (2002-10-01), None
patent: 2002329828 (2002-11-01), None
“Notification of Reasons for Rejection”—JPO Search Report listing cited references.

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