Semiconductor device with removably fixed lead frame

Details Semiconductor device with removably fixed lead frame Semiconductor device with removably fixed lead frame

1995-12-04

1997-11-25

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257787, 361752, 361813, 439400, H05K 720

Patent

active

056918844

ABSTRACT:
A semiconductor device of the invention is formed of an insulative case frame with a frame portion having elongated coupling holes, a radiator base plate covering a first opening of the insulative case frame, a circuit board with semiconductor chips bonded to the radiator base plate, a resin sealant filled in an inner space of the case frame for covering the circuit board, an insulative cover plate closing a second opening of the insulative case frame, and at least one lead frame having elastic coupling protrusions and inner leads. The elastic coupling protrusions are elastically retained in the elongated coupling holes to securely connect the lead frame to the case frame.

REFERENCES:
patent: 4180305 (1979-12-01), Ustin
patent: 4808122 (1989-02-01), Tomizu
patent: 5546280 (1996-08-01), Hasebe

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