Semiconductor device with reliable electrodes of projecting shap

Details Semiconductor device with reliable electrodes of projecting shap Semiconductor device with reliable electrodes of projecting shap

1997-03-10

1999-08-10

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, 438118, H01L 2144, H01L 2148, H01L 2150

Patent

active

059372770

ABSTRACT:
A method of forming a semiconductor device having a semiconductor chip having electrodes on which electrode pins are formed includes the steps of forming a complex having the electrode pins fixed in a fixing member, an arrangement of the electrode pins corresponding to that of the electrodes, connecting the electrode pins with the electrodes by mounting the complex on the semiconductor chip, and removing the fixing member from the complex mounted on the semiconductor chip.

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