Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-02-20
2007-02-20
Potter, Roy Karl (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C438S108000
Reexamination Certificate
active
10441677
ABSTRACT:
A semiconductor device with reinforced under-support structure and a method for fabricating the semiconductor device are provided, which can be used in the packaging of an MPBGA/TFBGA (Multi-Package Ball Grid Array & Thin Fine-pitch Ball Grid Array) module to help reinforce the TFBGA under-support structure therein. The proposed chip-packaging method is characterized by the provision of large-area solder pads at the corners of a solder-pad array used for TFBGA attaching application, in order to form solder bumps of a large cross section and volume during reflow process to help reinforce the TFBGA under-package structure. This feature can reinforce the TFBGA under-package structure without having to use flip-chip underfill technology, and without having to use extra large type solder balls and arrange pads into different pitches as in the prior art.
REFERENCES:
patent: 5381307 (1995-01-01), Hertz et al.
patent: 5641946 (1997-06-01), Shim
patent: 6020633 (2000-02-01), Erickson
patent: 6316735 (2001-11-01), Higashiguchi
patent: 6444563 (2002-09-01), Potter et al.
patent: 11-111768 (1999-04-01), None
Lin Ying-Ren
Shih Chin-Ming
Tsai Ho-Yi
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Potter Roy Karl
Siliconware Precision Industries Co. Ltd.
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