Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-01-10
2006-01-10
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000, C257S685000, C257S777000
Reexamination Certificate
active
06984882
ABSTRACT:
There is provided a semiconductor device comprising a semiconductor chip and an electronic part disposed adjacent to each other, wherein a terminal is provided on the side of each of the semiconductor chip and the electronic part, and the terminal is electrically connected to the other terminal in the state where the sides of the semiconductor chip and the electronic part approach to each other. Thereby, the size of the entire semiconductor device can be reduced, and the wiring path can be shortened significantly to improve electrical properties.
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Flynn Nathan J.
McDermott Will & Emery LLP
Renesas Technology Corp.
Tran Tan
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