Semiconductor device with reduced sensitivity to package stress

Details Semiconductor device with reduced sensitivity to package stress Semiconductor device with reduced sensitivity to package stress

2008-05-30

2011-11-15

Chapman, Jr., John (Department: 2856)

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

C073S514380

Reexamination Certificate

active

08056415

ABSTRACT:
A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.

REFERENCES:
patent: 5994161 (1999-11-01), Bitko et al.
patent: 6122963 (2000-09-01), Hammond et al.
patent: 6936492 (2005-08-01), McNeil et al.
patent: 2005/0005698 (2005-01-01), McNeil et al.
patent: 2007/0024156 (2007-02-01), Li et al.
Mukherjee, T., et al.; Structured Design of Microelectromechanical Systems; 34th Design Automation Conference; 1997; IEEE.
Xiong, X., et al.; A Dual-Mode Built-in Self-Test Technique for Capacitive MEMS Devices; IEEE Transactions on Instrumentation and Measurement, vol. 54, No. 5., Oct. 2005, pp. 1739-1750; IEEE.
O'Brien, G., et al.; Angular Accelerometer with Dual Anchor Support; 12th International Conference on Solid State Sensors, Actuators and Microsystems, Boston, Jun. 8-12, 2003; IEEE.
PCT Application No. PCT/US2009/037266; Search Report and Written Opinion; mailed Jul. 31, 2009.

Affiliated with

Also associated with

Rating

Semiconductor device with reduced sensitivity to package stress does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device with reduced sensitivity to package stress, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with reduced sensitivity to package stress will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4280504