Semiconductor device with read out prevention and method of...

Details Semiconductor device with read out prevention and method of... Semiconductor device with read out prevention and method of...

2007-06-19

2007-06-19

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified filler material

C257S787000, C257S922000, C257SE23069

Reexamination Certificate

active

10924206

ABSTRACT:
A semiconductor device has antenna pads and a testing pad formed on the substrate. An insulating resin layer containing a filler covers the testing pad, and bumps are provided on the antenna pads. Specific data in the semiconductor device are inhibited from being read out or rewritten, by the provision of the insulating resin layer containing a filler.

REFERENCES:
patent: 4860351 (1989-08-01), Weingart
patent: 6280858 (2001-08-01), Teshima
patent: 6864574 (2005-03-01), Nobori et al.
patent: 2002/0040923 (2002-04-01), Schredl et al.
patent: 2002/0058412 (2002-05-01), Ono et al.
patent: 2000/021939 (2000-01-01), None
patent: 2003-142539 (2003-05-01), None
patent: WO 01/60938 (2001-08-01), None
Korean Office Action dated Jan. 25, 2006, issued in corresponding Korean application.

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