Semiconductor device with protrusions

Details Semiconductor device with protrusions Semiconductor device with protrusions

2005-05-10

2005-05-10

Elms, Richard (Department: 2824)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

C257S676000, C257S787000, C438S121000, C438S123000, C438S124000, C438S127000

Reexamination Certificate

active

06891254

ABSTRACT:
A sealing process in a manufacturing method for semiconductor devices improves product reliability. A die pad14with a semiconductor chip32mounted thereon is placed between first and second molding dies40, 42such that the die pad14is supported above the second molding die42.A sealant30is then injected between the first and second molding dies40, 42to seal the semiconductor chip32.Part of the die pad14has one or more protrusions16projecting in the direction of the second molding die42.Injecting the sealant30presses the protrusions16against the second molding die42and seals the semiconductor chip32.

REFERENCES:
patent: 5578871 (1996-11-01), Fierkens
patent: 5750423 (1998-05-01), Ishii
patent: 5864174 (1999-01-01), Yamada et al.
patent: 6331448 (2001-12-01), Ahmad
patent: 6639306 (2003-10-01), Huang

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