Semiconductor device with potting resin structures

Details Semiconductor device with potting resin structures Semiconductor device with potting resin structures

1998-02-11

2000-02-22

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257667, 257687, 438123, 438124, H01L 2328

Patent

active

060283688

ABSTRACT:
A semiconductor apparatus that can limit the shifting of a semiconductor device when it is sealed with a sealing resin and can prevent bonding wires from being exposed at the surface of the sealing resin, and that can provide improved resistance to moisture and prevent deterioration of performance and reliability, potting resin structures are affixed to bonding wire mounting faces of a plurality of inner leads before they are sealed by a sealing resin, so that the tops of the potting resin structures are higher than the positions at which the bonding wires are mounted. With this arrangement, the shifting of the semiconductor device is halted by the potting resin structures, the bonding wires are not exposed at the surface of the sealing resin, and the potting resin structures and the sealing resin are closely attached, so that resistance to moisture is improved.

REFERENCES:
patent: 5757066 (1998-05-01), Inoue et al.

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