Semiconductor device with polygonal shaped die pad

Details Semiconductor device with polygonal shaped die pad Semiconductor device with polygonal shaped die pad

1994-12-05

1995-11-21

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257669, 257674, H01L 2328

Patent

active

054689937

ABSTRACT:
A semiconductor device includes a rectangular semiconductor chip bonded to a die pad of a lead frame in which a plurality of leads are arranged around the die pad. An area where the semiconductor ship is electrically connected with the leads around the semiconductor chip and the semiconductor chip are sealed with a resin. A distance between the semiconductor chip and a peripheral wall of the die pad is larger at a central portion of each side of the chip than at each corner of the chip. The leads are arranged such that a line connecting all lead ends is substantially parallel with the peripheral wall of the die pad.

REFERENCES:
patent: 4951119 (1990-08-01), Yonemochi et al.
patent: 5043791 (1991-08-01), Stokes et al.
patent: 5327008 (1994-07-01), Djennas et al.
Wentworth, Plane and Solid Geometry, Apr. 16, 1958, pp. 218-219.

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