Semiconductor device with plate heat sink free from cracks due t

Details Semiconductor device with plate heat sink free from cracks due t Semiconductor device with plate heat sink free from cracks due t

1998-10-15

2000-10-17

Fahmy, Wael

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438150, 438457, 438455, 257712, 257730, H01L 2150, H01L 2184, H01L 2130, H01L 2146, H01L 2334

Patent

active

06133071&

ABSTRACT:
A compound semiconductor pellet for a high electron mobility transistor is bonded to a metal plate heat sink of gold, and the metal plate heat sink is soldered to a package, wherein the metal plate heat sink is subjected to an orientation under application of heat before the soldering so as to cure warp of the compound semiconductor pellet, thereby decreasing the thermal stress due to the heat during the soldering.

REFERENCES:
patent: 3593412 (1971-07-01), Foote
patent: 5071785 (1991-12-01), Nakazato et al.
patent: 5783477 (1998-07-01), Kish, Jr. et al.
patent: 5801084 (1998-09-01), Beasom et al.

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