Semiconductor device with plastic package molding compound,...

Details Semiconductor device with plastic package molding compound,... Semiconductor device with plastic package molding compound,...

2004-10-25

2011-12-06

Mitchell, James M (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S666000, C257S790000

Reexamination Certificate

active

08072085

ABSTRACT:
A semiconductor device with a plastic package molding compound, a semiconductor chip and a leadframe is disclosed. In one embodiment, the semiconductor chip is embedded in a plastic package molding compound. The upper side of the semiconductor chip and the plastic package molding compound are arranged on a leadframe. Arranged between the leadframe and the plastic package molding compound with the semiconductor chip is an elastic adhesive layer for the mechanical decoupling of an upper region from a lower region of the semiconductor device.

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