Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2011-04-12
2011-04-12
Roman, Angel (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S783000, C257SE23031
Reexamination Certificate
active
07923823
ABSTRACT:
A method for producing semiconductor chips has the following steps for this purpose: firstly, a semiconductor wafer having a multiplicity of semiconductor chip positions arranged in rows and columns is provided, wherein the semiconductor wafer has on its front side front sides of semiconductor chips with integrated circuits. The rear side of the semiconductor wafer is provided with a coating having Parylene. The semiconductor wafer is subsequently singulated into semiconductor chips having rear sides on which the coating having Parylene is arranged.
REFERENCES:
patent: 4173664 (1979-11-01), Cieloszyk
patent: 5012322 (1991-04-01), Guillotte et al.
patent: 5965947 (1999-10-01), Nam et al.
patent: 6107674 (2000-08-01), Zommer
patent: 6228747 (2001-05-01), Joyner
patent: 6569709 (2003-05-01), Derderian
patent: 6583505 (2003-06-01), Choi
patent: 6593210 (2003-07-01), Rangarajan et al.
patent: 6743710 (2004-06-01), Dunham et al.
patent: 6756689 (2004-06-01), Nam et al.
patent: 6844623 (2005-01-01), Peterson et al.
patent: 6884623 (2005-04-01), Lomonossoff et al.
patent: 6908784 (2005-06-01), Farnworth et al.
patent: 6963125 (2005-11-01), Featherby et al.
patent: 7060526 (2006-06-01), Farnworth et al.
patent: 7262511 (2007-08-01), Osako et al.
patent: 7303942 (2007-12-01), Kuwabara et al.
patent: 2002/0034625 (2002-03-01), Grill et al.
patent: 2002/0125556 (2002-09-01), Oh et al.
patent: 2005/0085008 (2005-04-01), Derderian et al.
patent: 2005/0206010 (2005-09-01), Noquil et al.
patent: 2005/0227415 (2005-10-01), Farnworth et al.
patent: 2006/0263944 (2006-11-01), Lange
patent: 2007/0001278 (2007-01-01), Jeon et al.
patent: 102004034397 (2005-12-01), None
patent: 02048702 (2002-06-01), None
Mahler Joachim
Mengel Manfred
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Roman Angel
LandOfFree
Semiconductor device with parylene coating does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device with parylene coating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with parylene coating will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2689707