Semiconductor device with package to package connection

Details Semiconductor device with package to package connection Semiconductor device with package to package connection

2011-05-31

2011-05-31

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C438S121000, C257SE23001

Reexamination Certificate

active

07952182

ABSTRACT:
A semiconductor package comprises a first package; a second package that is provided on the first package; and a first interconnect that comprises a bump to couple to the first package and a base material layer to cover the bump, wherein the second package is supported on the base material layer that is coupled to the bump.

REFERENCES:
patent: 7498668 (2009-03-01), Kawabata et al.
patent: 7642656 (2010-01-01), Yoo et al.
patent: 2004/0036164 (2004-02-01), Koike et al.

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