Semiconductor device with no stress generated at the trench corn

Fishing – trapping – and vermin destroying

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357 55, 357 49, 437 67, H01L 2978, H01L 2906, H01L 2712

Patent

active

048946958

ABSTRACT:
The semiconductor device in which no stress occurs at the corner portion of the trench comprises a p type semiconductor substrate having a trench and a main surface, a thick insulating film formed on the bottom portion of the trench, a thin insulating film formed on the sidewall portion of the trench and connected to the end portion of the thick insulating film, and an n type impurity region formed in the semiconductor substrate only on the side portion of the thin insulating film.

REFERENCES:
patent: 4740827 (1988-04-01), Niitsu et al.
patent: 4751557 (1988-06-01), Sunami et al.

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