Semiconductor device with nested rows of contacts

Details Semiconductor device with nested rows of contacts Semiconductor device with nested rows of contacts

2011-04-22

2011-12-20

Lee, Cheung (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C438S127000, C257SE21499, C257SE21502

Reexamination Certificate

active

08080448

ABSTRACT:
A method of making semiconductor devices includes producing an array of first lead frames having rows of first electrical contact elements on respective sides. Sub-assemblies are produced by applying a first molding compound peripherally to provide support between the first electrical contact elements of each of the first lead frames, and singulating the sub-assemblies. An array of assemblies is produced, each of which includes a second lead frame having rows of second electrical contact elements on respective sides, a respective one of the sub-assemblies disposed in the second lead frame with the rows of first electrical contact elements nested adjacent to and inside the rows of second electrical contact elements, and a semiconductor die mounted on the sub-assembly. The assemblies are encapsulated using a second molding compound with the rows of first and second electrical contact elements exposed on adjacent sides of an active face of the respective assembly.

REFERENCES:
patent: 2008/0194081 (2008-08-01), Arshad et al.
patent: 2009/0188359 (2009-07-01), Arshad et al.
patent: 2011/0115061 (2011-05-01), Krishnan et al.

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