Semiconductor device with molten metal preventing member

Details Semiconductor device with molten metal preventing member Semiconductor device with molten metal preventing member

2008-08-05

2010-11-16

Smoot, Stephen W (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257SE23109

Reexamination Certificate

active

07834443

ABSTRACT:
A semiconductor includes a board, a semiconductor element mounted on the board, an electronic component, with the semiconductor element, mounted on the board, a heat radiation member provided so as to face the board, the heat radiation member configured to radiate heat of the semiconductor element, and a thermal connecting member being configured to thermally connect the heat radiation member and the semiconductor element. A metal material is used as the thermal connecting member, and an adhesion preventing member is provided so as to be separated from the electronic component, the adhesion preventing member being configured to prevent the metal material molten and flowing at a heating time being adhered to the electronic component.

REFERENCES:
patent: 6773963 (2004-08-01), Houle
patent: 2001/0050428 (2001-12-01), Ando et al.
patent: 2004/0026777 (2004-02-01), Yokoyama et al.
patent: 60-242647 (1985-02-01), None
patent: 63-310139 (1988-12-01), None
patent: 02-079451 (1990-03-01), None
patent: 2001-267473 (2001-09-01), None
patent: 2004-071977 (2004-03-01), None
International Search Report of PCT Application No. PCT/JP2006/303386 (mailed May 30, 2006).

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