Semiconductor device with magnetically permeable heat sink

Details Semiconductor device with magnetically permeable heat sink Semiconductor device with magnetically permeable heat sink

2006-12-26

2006-12-26

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21101

Reexamination Certificate

active

07153726

ABSTRACT:
A semiconductor device is attached to a heat sink by glue that is both thermally conductive and magnetically permeable. The glue fills different features in the surface of the semiconductor device so that there is good coupling between the semiconductor device and the heat sink. The glue is filled with magnetic particles so that the glue is magnetically permeable. The semiconductor device is formed with the heat sink at the wafer level and then singulated after attachment of the heat sink with the glue.

REFERENCES:
patent: 5849627 (1998-12-01), Linn et al.
patent: 6355501 (2002-03-01), Fung
patent: 6500694 (2002-12-01), Enquist
patent: 6761813 (2004-07-01), Xu
Li et al., “Magnetic Nanoscale Dots on Colloid Crystal Surfaces,” Applied Physics Letters, vol. 76, No. 6, 2000 American Institute of Physics, pp. 748-750.
Gross et al., “New Materials for High Performance No-Flow Underfill,” 2002 International Symposium on Microelectronics, pp. 234-238.

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