Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1997-04-09
1998-07-14
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257707, 257717, H01L 2310, H01L 2334
Patent
active
057809275
ABSTRACT:
A semiconductor device includes a heat radiator having a convex portion. A reinforcement plate having a thermal conductivity is soldered on a portion of the convex portion of the heat radiator by a solder having a Young's modulus lower than a silver copper solder and a melting point lower than the silver copper solder. A semiconductor element soldered on the reinforcement plate by the solder.
REFERENCES:
patent: 4615031 (1986-09-01), Eales et al.
patent: 5299214 (1994-03-01), Nakamura et al.
patent: 5324987 (1994-06-01), Iacovangelo et al.
Clark S. V.
NEC Corporation
Saadat Mahshid D.
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