Semiconductor device with leads engaged with notches

Details Semiconductor device with leads engaged with notches Semiconductor device with leads engaged with notches

1999-06-02

2000-08-29

Potter, Roy

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257666, 257692, 257787, H01L 2348

Patent

active

061113123

ABSTRACT:
A semiconductor device is provided. This semiconductor device includes a resin package, a semiconductor chip, and leads consisting of inner leads and outer leads. The rear surface of the semiconductor chip and the inner leads are situated substantially on the same plane. The resin package is provided with notches on its mounting surface. The outer leads are bent inward along the exterior of the resin package and pulled around to the mounting surface, so that the edges of the outer leads are engaged with the notches.

REFERENCES:
patent: 5327104 (1994-07-01), Kikushima

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