Semiconductor device with lead structure on principal surface of

Details Semiconductor device with lead structure on principal surface of Semiconductor device with lead structure on principal surface of

1996-09-26

1999-02-09

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257684, 257707, H01L 2348

Patent

active

058698884

ABSTRACT:
A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.

REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 4989069 (1991-01-01), Hawkins
patent: 5583375 (1996-12-01), Tsubosaki et al.

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