Semiconductor device with lead frame of molded container

Details Semiconductor device with lead frame of molded container Semiconductor device with lead frame of molded container

1994-12-27

1996-05-28

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257728, H01L 2348

Patent

active

055214312

ABSTRACT:
The molded type semiconductor device has a semiconductor chip mounted and molded on a lead frame. The device includes a stub which has an open end at a portion of the lead frame and which is connected to a ground electrode of the semiconductor chip, and a mold resin which molds the stub together with the semiconductor chip. The stub has a length that is a 1/4 wavelength of a signal wavelength used in the device. The stub is formed in a zigzag form or a spiral form. Due to such stub, the satisfactory grounding is ensured to accomplish a simple molded type structure and to improve circuit characteristics.

REFERENCES:
patent: 4780795 (1988-10-01), Meinel
patent: 4989068 (1991-01-01), Yasuhara et al.
patent: 5229846 (1993-07-01), Kozuka
patent: 5276352 (1994-01-01), Komenaka et al.
patent: 5382829 (1995-01-01), Inoue

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