Semiconductor device with lead frame having different thicknesse

Details Semiconductor device with lead frame having different thicknesse Semiconductor device with lead frame having different thicknesse

1994-03-09

1995-09-19

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054518130

ABSTRACT:
A semiconductor device includes a lead frame which has an island portion on which a semiconductor chip is mounted and which is coated with a sealing resin, inner lead portions which are connected to electrodes of the semiconductor chip and are coated with the sealing resin; and outer lead portions which are continuously extended from the inner lead portions and are not coated with the sealing resin. The island portion and inner lead portions are formed to be smaller in thickness than the outer lead portions by, for example, rolling a roller along a material for the lead frame.

REFERENCES:
patent: 3947867 (1976-03-01), Duffek et al.
patent: 4099200 (1978-07-01), Koutalides
patent: 4663651 (1987-05-01), Gilder et al.
patent: 4717700 (1987-02-01), Cusak
patent: 4771330 (1988-09-01), Long
patent: 4872260 (1989-10-01), Johnson et al.
patent: 5014113 (1991-05-01), Casto

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