Semiconductor device with improved planarity and reduced parasit

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

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257374, 257396, 257397, 257390, 257333, 257506, 438296, 438425, 438183, H01L 2900

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active

06153918&

ABSTRACT:
In a semiconductor device and a method of manufacturing the same, a dummy region which can suppress occurrence of a parasitic capacity can be provided for reducing a difference in level without increasing manufacturing steps in number. A semiconductor substrate is provided at its main surface with an isolation region formed by a trench, and a dummy region leaving the main surface is formed in the isolation region for the purpose of reducing an influence by the difference in level in a later step. The dummy region includes p- and n-type impurity regions each extending a predetermined depth from the surface. Since a pn junction occurs at the bottom of the impurity region, a depletion layer spreads in the pn junction, and thereby reduces a parasitic capacity between the dummy region and a conductive interconnection located in a crossing direction at a higher position. The impurity regions and source/drain regions of p- and n-channel transistors in active regions are simultaneously formed by impurity implantation.

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patent: 5923969 (1999-07-01), Oyamatsu

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