Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-06-04
2010-10-05
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257SE23047, C257SE23125, C257S666000, C257S784000, C257S786000, C257S737000, C257S738000, C257S670000, C257S669000, C257S671000, C257S672000, C257S696000, C257S698000
Reexamination Certificate
active
07808088
ABSTRACT:
A semiconductor device comprises a die having a first surface and a second surface, a first leadframe connected to the first surface and the second surface, and a second leadframe connected to the first surface.
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Brady III Wade J.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
Williams Alexander O
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