Semiconductor device with improved heat dissipation, and a...

Details Semiconductor device with improved heat dissipation, and a... Semiconductor device with improved heat dissipation, and a...

2006-10-03

2006-10-03

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21499

Reexamination Certificate

active

07115444

ABSTRACT:
A semiconductor device includes a semiconductor chip, a heat dissipation member for dissipating heat generated by the semiconductor chip, and a coupling member which thermally couples the semiconductor chip to the heat dissipation member, wherein the coupling member is made of metal and deformable to absorb a stress generated between the semiconductor chip and the heat dissipation member, the coupling member and the semiconductor chip being joined through metal-metal bonding.

REFERENCES:
patent: 4838347 (1989-06-01), Dentini et al.
patent: 5527604 (1996-06-01), Hayashi
patent: 5623394 (1997-04-01), Sherif et al.
patent: 5637925 (1997-06-01), Ludden et al.
patent: 5763950 (1998-06-01), Fujisaki et al.
patent: 5990552 (1999-11-01), Xie et al.
patent: 6127724 (2000-10-01), DiStefano
patent: 6340822 (2002-01-01), Brown et al.
patent: 6383923 (2002-05-01), Brown et al.
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 6660566 (2003-12-01), Masayuki
patent: 6812548 (2004-11-01), Dias et al.
patent: 6841413 (2005-01-01), Liu et al.
patent: 2001/0028110 (2001-10-01), Andoh
patent: 2002/0031918 (2002-03-01), DeRochemont et al.
patent: 2003/0127727 (2003-07-01), Suehiro et al.
patent: 2 813 146 (2002-02-01), None
patent: 57-176750 (1982-10-01), None
patent: 60094744 (1985-05-01), None
patent: 01-117049 (1989-05-01), None
patent: 02121332 (1990-05-01), None
patent: 10-050770 (1998-02-01), None
patent: 11-067998 (1999-03-01), None

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