Semiconductor device with improved design freedom of...

Details Semiconductor device with improved design freedom of... Semiconductor device with improved design freedom of...

2006-12-19

2006-12-19

Trinh, Michael (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S783000

Reexamination Certificate

active

07151320

ABSTRACT:
A semiconductor device comprises: a semiconductor chip having a first main surface, a second main surface, and a plurality of side surfaces; an extension portion which contacts and surrounds the side surfaces of the semiconductor chip; a base, which is capable of conducting heat generated by the semiconductor chip; an insulating film which is formed on the first face and the first main surface; a plurality of wiring patterns extended from electrode pads to the upper side of the first face of the extension portion; a sealing portion which is formed on the wiring patterns and insulating film; and a plurality of external terminals provided over the wiring patterns in a region including the upper side of the extension portion.

REFERENCES:
patent: 6268648 (2001-07-01), Fukutomi et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6455920 (2002-09-01), Fukasawa et al.
patent: 2002/0192867 (2002-12-01), Nishiyama
patent: 11-233678 (1999-08-01), None
patent: 11-251493 (1999-09-01), None
patent: 2000-124354 (2000-04-01), None
patent: 2000-208556 (2000-07-01), None
patent: 2000-277682 (2000-10-01), None
patent: 2000-516044 (2000-11-01), None
patent: 2001-308116 (2001-11-01), None
patent: 2002-016173 (2002-01-01), None
patent: 2002-231854 (2002-08-01), None
English-language translation of JP patent publication No. 2002-016173.

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